Unlock the full potential of your semiconductor designs with our cutting-edge Outsourced Semiconductor Assembly and Test (OSAT) services with our advanced packaging and testing solutions.
Our expertise ensures your semiconductor designs achieve unmatched efficiency and functionality.
Delivering groundbreaking solutions to meet evolving semiconductor demands.
Optimizing electrical, thermal, and mechanical efficiency for better results.
Enabling compact designs with advanced small-scale packaging technologies.
Combining diverse functionalities into seamless, space-saving solutions.
From wafer-level packaging to final testing, our comprehensive OSAT solutions drive your semiconductor designs from concept to market-ready products.
Our advanced Testing Service is equipped with industry-leading capabilities, providing wafer probe, final test, system-level test, and burn-in solutions for a diverse range of integrated circuits.
We offer diverse packaging solutions, from lead frame to substrate base, with advanced wire bond and flip chip technologies. Our innovations cater to PC, mobile, and communication markets, pushing semiconductor boundaries.
Our wafer bumping solutions deliver reliable interconnections using solder bumps, copper pillars, and redistribution layers for flip chip and wafer-level packaging. Designed for optimal electrical, thermal, and mechanical performance.
Our Quality Test Center offers a full spectrum of reliability tests, including environmental, life, and board-level assessments. We provide in-depth failure analysis services, ensuring the highest standards of semiconductor quality and performance for our clients' products.
High-End Application for High Performance Computing & Data servers.
Offer higher number of I/O to silicon chip and increase the package size.
Enables compact, high-performance devices with improved integration efficiency.
Enables shorter connections, and efficient thermal management.
Enables cost-effective, flexible interconnections for semiconductor performance.
Ensures compact, reliable integration for precise environmental interaction.
Enabling advanced semiconductor solutions for diverse industries with precision and efficiency.
